Transforming semiconductor production
The semiconductor industry demands constant innovation to meet the complex challenges of microchip production. Companies that fail to integrate AM processes risk falling behind, compromising their competitive edge in the market.
Additive manufacturing (AM) allows for significantly higher design freedom, leading to faster and more accurate systems while driving down costs. This ensures you stay at the forefront of technological advancements and ever-evolving semiconductor industry demands.
Providing end-to-end support and a technological edge for automotive and motorsport companies
Additive Industries support our partners in the high-tech and semiconductor industry – equipping them with the tools and knowledge to successfully deliver production parts
Learn more about how we work together
Additive Industries: A partner in your metal AM journey
1. Understand
We take the time to understand your product portfolio, supporting through part selection and business case development.
2. Guidance
We provide full guidance in design for AM production and introduce techniques to optimise your parts, including common design tools and tailoring functional part design to the process.
3. Process
We can offer a full service for process parameter and material development, with bespoke parameter sets for new or existing materials, tailored to challenging features.
4. Optimisation
We work with you to optimise build set-up, developing application-specific parameters where needed, introduce process simulation tools and techniques, and offer guidance for advanced strategies such as hybrid AM manufacturing to further optimise your production workflow.
5. Post-processing
We advise on post-processing methods, including heat treatments, support removal, post-machining and surface improvement methods – helping you to select the optimal downstream workflow to align with your application and business case.
Explore our success stories
Scaling semiconductor precision with Additive Industries & ASML
Additive Industries, in collaboration with ASML, Delft University of Technology, MI-Partners, Nexperia and Infinite Simulation Systems, has produced ground breaking topologically optimised wafer stage components for lithography machines. Utilising our MetalFab system, this automated approach enhanced precision, significantly reduced time to market and achieved an optimal balance of stiffness and mass, setting new standards in high-tech motion systems.
The material and process in place to fit the application
Titanium alloys are widely used in semiconductor machinery for components in vacuum applications, gas distribution systems, and wafer‑handling hardware, where cleanliness and material stability are critical. Their extremely low outgassing and low contamination characteristics help maintain ultra‑high vacuum environments, while their excellent corrosion resistance allows them to withstand aggressive plasma chemistries and halogen-based process gases. In addition, titanium alloys offer a high strength‑to‑weight ratio, thermal stability, and non‑magnetic behaviour, making them well suited for precision mechanical parts and cleanroom-compatible assemblies in advanced semiconductor equipment.
Steel alloys such as stainless 316L are also common in semiconductor machinery. Its excellent resistance to corrosion and oxidation allows it to withstand aggressive chemicals, ultra‑pure water, and specialty gases without degrading, while its low carbon content improves weldability and minimizes contamination from intergranular corrosion. Our MetalFab technology is supporting our partners to deliver serial production applications using stainless steel 316L to tight geometric tolerances and consistent material quality in this demanding industry.
The unique demands of the semiconductor machinery industry call for a wider range of exotic, and conventionally hard to process materials. We have worked with leading companies to develop both new materials and specific parameter sets to unlock further opportunities for metal additive manufacturing applications, and out team of materials and process engineers can support every step of the way when bespoke requirements are called for. Examples of such materials include:
- Copper alloys
- Refractory materials (tungsten, molybdenum etc.)
- Nickel steel alloys (INVAR 36 etc.)
Are you ready to take your semiconductor manufacturing to the next level?
Do you have further questions or specific objectives? Reach out to us and challenge us with your applications – we’re passionate about hearing your ambitions and empowering you to achieve them.